Connecting you to the Future of Superabrasives Technology, Today
Zürich, Switzerland, August 8, 2022 – Superabrasives leader Meister Abrasives announces its participation in the International Conference on Silicon Carbide and Related Materials (ICSCRM) in September 2022. For the first time ever, Swiss company Meister Abrasives will take part in Continue Reading →
It’s finally here – the inspiring video that reflects the precision, attention to detail, and craftsmanship with which our semiconductor grinding solutions are made. Watch the video below to get a sneak peak inside!
by Carmine Sileno, Product Manager, Semiconductor Industry, and Dr. Diego Calvo Ruiz, Sales and Business Development Manager, Meister Abrasives The key role of silicon (Si) in the semiconductor industry over recent decades has hugely broadened its applications. Although the wide Continue Reading →
Meister Abrasives’ advanced vitrified diamond wheels provide users with more options for cost-effectively handling the most difficult non-ferrous grinding applications: Applications Include: Rotary Surface Grinding OD Cylindrical Grinding Prime Wafer Thinning Wafer Backgrinding Bore Grinding Fine Grinding Types of Parts Continue Reading →