Non-ferrous Grinding Problem Solvers:

Meister Abrasives’ advanced vitrified diamond wheels provide users with more options for cost-effectively handling the most difficult non-ferrous grinding applications:

Applications Include:

  • Rotary Surface Grinding
  • OD Cylindrical Grinding
  • Prime Wafer Thinning
  • Wafer Backgrinding
  • Bore Grinding
  • Fine Grinding

Types of Parts

Medical implants, semiconductor wafers, optics, electronic components, cutting tools, aerospace engine and wear components, high-end bearings

Materials Ground

  • Advanced Ceramics such as: Silicon, Silicon Carbide, Silicon Nitride, Sapphire, Alumina, Glass, Quartz
  • HVOF thermal spray coatings containing Tungsten Carbide, Cobalt, Nickel, and Chrome
  • Hard Cutting Tool Materials such as Tungsten Carbide and Titanium

Throughput Improvements

  • Stock removal rates improved between 20%-50% over resin and metal bonded diamond wheels

Achievable Finishes

  • Advanced ceramics, such as silicon carbide, finishes as smooth as 1.5-2 nm (nanometer) Ra.
  • For finishing operations to reduce or eliminate the need for subsequent polishing:
  • Carbide tools (for example inserts) down to 14 nm Ra

About joelcassola

Joel Cassola is a commercial journalist who has written feature articles and case histories for clients in more than 100 trade magazines.
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