technology – The Meister Toolbox

𝗨𝗹𝘁𝗿𝗮𝗙𝗶𝗻𝗲 𝗚𝗿𝗶𝗻𝗱𝗶𝗻𝗴 𝗼𝗳 𝗧𝘂𝗻𝗴𝘀𝘁𝗲𝗻 𝗖𝗮𝗿𝗯𝗶𝗱𝗲 – 𝗥𝗲𝗽𝗹𝗮𝗰𝗶𝗻𝗴 𝗟𝗮𝗽𝗽𝗶𝗻𝗴 𝗶𝗻 𝗜𝗻𝘀𝗲𝗿𝘁 𝗣𝗿𝗼𝗱𝘂𝗰𝘁𝗶𝗼𝗻

Posted on August 21, 2026 by Bruce Northrup — Leave a reply

Finishing tungsten carbide is one of the most demanding grinding operations, especially when surface quality and productivity must go hand in hand. With our UltraFine grinding technology, we achieved outstanding results: ✔ Surface finish down to Ra 0.025 µm ✔ Continue Reading →

Semiconductor Solutions Video

Posted on December 14, 2021 by Bruce Northrup

It’s finally here – the inspiring video that reflects the precision, attention to detail, and craftsmanship with which our semiconductor grinding solutions are made. Watch the video below to get a sneak peak inside!

Defeat the Heat

Posted on November 10, 2021 by Bruce Northrup

Learn how Meister Abrasives’ proprietary High Performance Lubrication (HPL) Grinding Wheels produce better quality parts, faster, and with less burning, while at the same time improving wheel life and reducing abrasive cost per part. When grinding today’s most complex parts Continue Reading →

New Flyers Online

Posted on May 20, 2020 by Bruce Northrup

Meister has published a new series of product flyers, highlighting the latest abrasive technologies and innovations for: Precision grinding tools for the semiconductor industry Internal cylindrical grinding in CBN & diamond Internal cylindrical grinding in corundum & silicon carbide Honing Continue Reading →

INTERNATIONAL FOCUS

Posted on October 2, 2019 by Bruce Northrup

19th International Technical Meeting (ITM)– high above Lake Lucerne The 19th annual ITM (International Technical Meeting) took place on the 27th & 28th of September at Mt. Stoos Switzerland, at over 1300m above sea level. 41 participants from over twelve Continue Reading →

Meister Installs New White Room

Posted on May 23, 2019 by Bruce Northrup

Custom tailored solutions for semiconductor manufacturing with technology transfers to other industries Meister Abrasives AG has completed the installation of a new white room at the company’s headquarters and manufacturing plant in Andelfingen, Switzerland. The purpose of this new facility Continue Reading →

There’s a New Look to Meister at IMTS This Year!

Posted on June 25, 2018 by Ross Hudson

There is always a lot to see when you visit Meister at IMTS. For 2018 there’s even more to talk about, including our new “amphitheater” design. The airy wide-open layout will provide you with an up close and personal look Continue Reading →

NEWS!

Posted on June 21, 2018 by Ross Hudson

“Meister Abrasives Exhibits Innovative Grinding Wheel Technology at IMTS 2018” Click here to read the full press release There will be a lot to see when you visit Meister at this year’s IMTS show. Over the next few months we’ll Continue Reading →

CASE STUDY: HPL Technology for Creep-Feed Grinding

Posted on May 3, 2018 by Bruce Northrup

Anti-friction bond technology reduces cycle time and eliminates burn in high production creep-feed grinding of Planer Knives. In this case study, a volume producer of planer knives for the woodworking industry requested assistance with their grinding process. Continue Reading →

HPL Test Results Are In

Posted on January 26, 2018 by Ross Hudson

Meister’s New HPL Anti-Friction Technology Gets High Grades Since Meister introduced its new HPL anti-friction bond technology the Company has been conducting field trials with numerous customers looking to improve their high precision grinding processes. The tests compare results produced Continue Reading →