Zürich, Switzerland, August 8, 2022 – Superabrasives leader Meister Abrasives announces its participation in the International Conference on Silicon Carbide and Related Materials (ICSCRM) in September 2022.
For the first time ever, Swiss company Meister Abrasives will take part in the International Conference on Silicon Carbide and Related Materials (ICSCRM). The 19th edition of the conference will take place in September 11-16, 2022 in Davos, Switzerland – a mountainous town in the heart of the Canton of Grisons that takes great pride in its “Energy Town Label” awarded by the Swiss Federal Department of Energy for improving its CO2 balance and reinforcing climate protection. The ICSCRM held at the Davos Congress Centre, aims at discussing the latest advances in Silicon Carbide (SiC) technology – from its crystal growth to the reliability in application. As an official exhibitor, Meister Abrasives will present its latest technological innovation in the area of laser split SiC substrates – a unique combination of Meister’s Ceramet DIA and Ultra-Fine 6 (UF6) DIA grinding wheels.
Since during the manufacturing process as little as possible SiC substrate material loss is desired, different wafering laser split technologies were developed. Splitting the boule into wafers by a laser result in different surface qualities compared to wafering with diamond- or slurry-based wire sawing processes. This unique laser-split surface is very demanding and aggressive for the subsequent grinding process. Meister Abrasives presents its customized Ceramet DIA grinding wheel with its novel bond technology for rough grinding. This wheel reduces the TTV of laser split SiC to <2 µm in one standard rough grinding cut, while at the same time performing with outstanding low wheel wear rates. In combination to this rough grinding solution, Meister Abrasives further developed its high-performing VIT DIA UF6 wheel. Its ultra-fine vitrified bond grinding technology enables CMP-ready surfaces on such pre-ground laser split substrates. The unique combination of cutting-edge Meister Ceramet DIA and UF6 DIA technologies achieves polish-grade surfaces on laser split SiC substrates. This enables SiC manufacturers to produce epitaxy-ready prime wafers more economically and faster than ever before.
Visit Meister Abrasives’ pavilion – booth R037, level 3 – to discover the brand’s latest innovation and personally meet the brand’s experts on SiC. Immerse into Meister Abrasives’ world and learn more about the brand’s cutting-edge technological solutions that empower people in their everyday life.
ABOUT MEISTER ABRASIVES
Meister Abrasives is a leading and highly innovative company with extensive experience in developing and manufacturing customized cutting-edge industrial superabrasive tools for high-precision grinding applications. Founded in 1951 in Switzerland, Meister Abrasives is synonymous to exceptional quality, precision, and individualized customer solutions – values inherent not only to the brand but also to the land in which it originated – Switzerland. Being at the forefront of technological innovation, Meister Abrasives is dedicated to its quest of creating innovation with a higher meaning through processes optimization, sustainable use of resources, control of own manufacturing processes, and uncompromising attitude to quality in customer care, facilitated by the brand’s international structure with family values.
ABOUT INTERNATIONAL CONFERENCE ON SILICON CARBIDE AND RELATED MATERIALS (ICSCRM)
The International Conference on Silicon Carbide and Related Materials (ICSCRM) is the most important technical conference series on silicon carbide (SiC) and related materials. Inaugurated in Washington, D.C. in 1987, the conference series is a biennial event that developed into the premier global forum for technical discussion in all areas of silicon carbide (SiC) and related materials, such as other wide bandgap (WBG) semiconductors. The topics covered in the 19th ICSCRM include bulk growth and wafer manufacturing, characterization, devices, quantum technology, processing, packaging and applications, reliability, as well as related materials and respective cross-disciplinary topics. The aim of ICSCRM is to provide a discussion platform for academic and industrial contributions to the further development of SiC and its applications, for accomplished and world-renowned experts and young students at the beginning of their career alike.
The 19th edition of ICSCRM will be the last of its kind – starting from 2023, the conference series will be united with the European edition. It will form an annual event under the well-established name ICSCRM and a new rotation schedule integrating the SiC communities worldwide.