Meister Abrasives’ advanced vitrified diamond wheels provide users with more options for cost-effectively handling the most difficult non-ferrous grinding applications:
Applications Include:
- Rotary Surface Grinding
- OD Cylindrical Grinding
- Prime Wafer Thinning
- Wafer Backgrinding
- Bore Grinding
- Fine Grinding
Types of Parts
Medical implants, semiconductor wafers, optics, electronic components, cutting tools, aerospace engine and wear components, high-end bearings
Materials Ground
- Advanced Ceramics such as: Silicon, Silicon Carbide, Silicon Nitride, Sapphire, Alumina, Glass, Quartz
- HVOF thermal spray coatings containing Tungsten Carbide, Cobalt, Nickel, and Chrome
- Hard Cutting Tool Materials such as Tungsten Carbide and Titanium
Throughput Improvements
- Stock removal rates improved between 20%-50% over resin and metal bonded diamond wheels
Achievable Finishes
- Advanced ceramics, such as silicon carbide, finishes as smooth as 1.5-2 nm (nanometer) Ra.
- For finishing operations to reduce or eliminate the need for subsequent polishing:
- Carbide tools (for example inserts) down to 14 nm Ra
