Semiconductor technology enables quantum leap in steel machining
VM bore grinding wheel on a UVA U80 in the Meister Abrasives AG grinding laboratory
Significant reductions required in exhaust gas emissions require a quantum leap in grinding technology for the fuel injection industry. See how Meister’s VM (Vitrified Micron) Technology, originally pioneered for the semiconductor industry, has been adapted to solve these challenges with super-precise, highly porous, fine-mesh CBN wheels for bore and seat grinding.
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