Connecting you to the Future of Superabrasives Technology, Today
It’s finally here – the inspiring video that reflects the precision, attention to detail, and craftsmanship with which our semiconductor grinding solutions are made. Watch the video below to get a sneak peak inside!
Learn how Meister Abrasives’ proprietary High Performance Lubrication (HPL) Grinding Wheels produce better quality parts, faster, and with less burning, while at the same time improving wheel life and reducing abrasive cost per part. When grinding today’s most complex parts Continue Reading →
Meister has published a new series of product flyers, highlighting the latest abrasive technologies and innovations for: Precision grinding tools for the semiconductor industry Internal cylindrical grinding in CBN & diamond Internal cylindrical grinding in corundum & silicon carbide Honing Continue Reading →
19th International Technical Meeting (ITM)– high above Lake Lucerne The 19th annual ITM (International Technical Meeting) took place on the 27th & 28th of September at Mt. Stoos Switzerland, at over 1300m above sea level. 41 participants from over twelve Continue Reading →
Custom tailored solutions for semiconductor manufacturing with technology transfers to other industries Meister Abrasives AG has completed the installation of a new white room at the company’s headquarters and manufacturing plant in Andelfingen, Switzerland. The purpose of this new facility Continue Reading →
There is always a lot to see when you visit Meister at IMTS. For 2018 there’s even more to talk about, including our new “amphitheater” design. The airy wide-open layout will provide you with an up close and personal look Continue Reading →
“Meister Abrasives Exhibits Innovative Grinding Wheel Technology at IMTS 2018” Click here to read the full press release There will be a lot to see when you visit Meister at this year’s IMTS show. Over the next few months we’ll Continue Reading →
Anti-friction bond technology reduces cycle time and eliminates burn in high production creep-feed grinding of Planer Knives. In this case study, a volume producer of planer knives for the woodworking industry requested assistance with their grinding process. Continue Reading →
Meister’s New HPL Anti-Friction Technology Gets High Grades Since Meister introduced its new HPL anti-friction bond technology the Company has been conducting field trials with numerous customers looking to improve their high precision grinding processes. The tests compare results produced Continue Reading →
Intrinsic lubrication delivers faster grinding without burning… According to Dr. Peter Beyer, Meister Abrasives’ CEO and Chief Technologist, the new HPL super abrasive wheels are a significant extension of the Company’s proprietary HPB (High Performance Bonding Technology). It departs from Continue Reading →