Zürich, Switzerland, August 21, 2023 – Superabrasives leader Meister Abrasives announces its participation in the International Conference on Silicon Carbide and Related Materials (ICSCRM) in September 2023.
Swiss company Meister Abrasives will exhibit at the International Conference on Silicon Carbide and Related Materials (ICSCRM) on September 17-22, 2023, at the Hilton Sorrento Palace. This year’s edition of the conference will be hosted in a magnificent little village in the heart of the Mediterranean – Sorrento, Italy, the birthplace of limoncello. For the first time ever, the two traditionally separated ICSCRM and ECSCRM conferences merge into a single annual scientific event that explores, presents, and discusses the newest achievements in the field of wide-bandgap semiconductors focusing on silicon carbide (SiC) and other wide bandgap semiconductors. As an official exhibitor, Meister Abrasives will present its optimized technological solution for grinding laser split SiC substrates – a unique combination of Meister’s CleanCut (CC) DIA and UltraFine 6 (UF6) DIA grinding wheels.
The focus on minimizing material loss during SiC substrate production has prompted the emergence of different laser split technologies. The resulting surface of such laser-split wafers widely differs from that of wire-sawed wafers by it being rather demanding and aggressive. To overcome the challenges associated with processing laser-split wafers, Meister Abrasives has developed a two-step approach: a hybrid-bonded rough grinding wheel followed by a vitrified-bonded fine grinding wheel. The hybrid CleanCut DIA wheel exhibits high removal rates in a single standard rough grinding cut while maintaining low wheel wear rates. To achieve CMP-ready surfaces, a vitrified-bonded UltraFine DIA wheel is employed at the subsequent fine grinding step. This potent combination of CC DIA and UF6 DIA technologies maximizes the benefits of laser splitting by achieving polish-grade surfaces on SiC substrates. SiC manufacturers can now produce epitaxy-ready prime wafers more economically.
Visit Meister Abrasives’ pavilion – booths 15&16 – to discover the brand’s latest grinding solutions and personally meet Meister’s experts on SiC.
ABOUT MEISTER ABRASIVES
Meister Abrasives is a leading and highly innovative company with extensive experience in developing and manufacturing customized cutting-edge industrial superabrasive tools for high-precision grinding applications. Founded in 1951 in Switzerland, Meister Abrasives is synonymous to exceptional quality, precision, and individualized customer solutions – values inherent not only to the brand but also to the land in which it originated – Switzerland. Being at the forefront of technological innovation, Meister Abrasives is dedicated to its quest of creating innovation with a higher meaning through processes optimization, sustainable use of resources, control of own manufacturing processes, and uncompromising attitude to quality in customer care, facilitated by the brand’s international structure with family values.
ABOUT INTERNATIONAL CONFERENCE ON SILICON CARBIDE AND RELATED MATERIALS (ICSCRM)
The International Conference on Silicon Carbide and Related Materials (ICSCRM) is the most important technical conference series on silicon carbide (SiC) and related materials. Inaugurated in Washington, D.C. in 1987, the conference series is a biennial event that developed into the premier global forum for technical discussion in all areas of silicon carbide (SiC) and related materials. The ICSCRM serves as an international forum for the exchange of ideas on recent scientific and technical issues among researchers and engineers in industrial, academic, and public sectors.
This year’s event marks yet another milestone in the conference series – for the first time ever, the international (ICSCRM) and European (ECSCRM) editions merge into a single event that will be held annually.