Custom tailored solutions for semiconductor manufacturing with technology transfers to other industries
Meister’s new White Room for the preparation of ultra-fine vitrified grinding wheels
Meister Abrasives AG has completed the installation of a new white room at the company’s headquarters and manufacturing plant in Andelfingen, Switzerland. The purpose of this new facility is to prevent cross-contamination of micron and sub-micron size abrasive crystals during the manufacturing of ultra-fine vitrified grinding wheels used in the semiconductor manufacturing processes.
Dr. Peter Beyer, CEO and Chief Technology Officer of Meister Abrasives, says Meister has developed a number of innovative ultra-fine grit abrasive solutions that allow the grinding wheels to improve the surface quality of extremely hard materials without having to reduce grinding speeds or cycles times. These results have led to a 40% increase in the sale of Meister products to the semiconductor industry in the past year alone.
Dr. Beyer said that Meister anticipates continued growth in this market and the white room is large enough to be expanded many times over to make this possible. In addition, cross-over technology spun out of Meister’s semiconductor R&D is now being successfully applied to ultra-precision internal grinding applications in other industries.
